Advanced Thermal Management
Application Cases
TPMS Liquid Cold Plates
This is the most critical and frequently mentioned advanced application, utilizing TPMS to optimize fluid dynamics and heat exchange.
Core Advantages
- Core Structure: Uses Gyroid, or Diamond lattice structures to fill flow channels.
- Performance Advantage: Provides massive Surface Area compared to traditional channels, ensuring uniform fluid distribution and eliminating Hot Spots.
- Efficiency Boost: Heat transfer performance improves by approximately 28% under the same pumping power, with significantly reduced flow resistance.
- Manufacturing: Monolithic printing eliminates brazing and removes leakage risks.
New Generation IGBT Heatsink Base Plate
Designed for IGBT power modules in EVs or industrial controls, breaking the limits of traditional cold-forged pin fins.
Core Advantages
- Background: Traditional Pin Fin technology has hit a thermal bottleneck.
- Micro‑structure Design: Bottom features irregular concave and convex textures. Surface covered with conical columns with spiral micro‑structures, impossible with cold forging. Added horizontal square strips for turbulence induction.
- Results: Thermal efficiency improved by 30%‑40% within the same installation space.
Data Processor Thermal Module
Addressing poor thermal uniformity in traditional heatsinks for servers or high-performance chips.
Core Advantages
- Replacement: Replaces copper sheet heatsinks.
- Design Change: Internally features a fin‑based, needle+rectangular‑based, and a combination of multiple structures.
- Function: Increases surface area and acts as a fluid guide, significantly improving thermal uniformity.
Semiconductor Thermal Module
For semiconductor components with extremely high heat flux density, demanding massive efficiency gains.
Core Advantages
- Goal: Customer required a 5x efficiency increase over the original copper plate solution.
- Structure: Combines irregular textures, spiral micro‑structure cones, and horizontal strips into a composite design.
- Test Results: Final tests showed a 6‑7x increase in thermal efficiency.
- Process: 3D printed base plate + welded cover (Hybrid manufacturing).
Teardrop-Shaped Liquid Cold Plates
Designed to minimize pressure drop and fluid resistance using hydrodynamic optimization.
Core Advantages
- Core Design: Features an array of teardrop‑shaped pin fins.
- Fluid Dynamics: Compared to cylindrical pins, the teardrop shape significantly reduces fluid flow separation and turbulence, leading to a much lower pressure drop.
- Efficiency: Maintains high heat transfer efficiency while allowing for lower pumping power or higher flow rates.
Conformal Channel Liquid Cold Plate
Utilizing 3D printing freedom to create non-linear, conformal cooling channels.
Core Advantages
- Conformal Cooling: Channels are designed to follow the 3D contour of the heat source, rather than a simple 2D plane.
- Internal Features: Internally features a fin‑based, needle+rectangular‑based, and a combination of multiple structures to maximize turbulence and surface area in critical zones.
- Benefits: Solves the issue of uneven heating in complex‑shaped components where traditional machining cannot reach.
Aluminum Alloy Heat Exchangers
Lightweight, high-strength heat exchangers for automotive applications, overcoming traditional brazing limits.
Core Advantages
- Material: High‑strength Aluminum Alloy (e.g. AlSi10Mg), offering a balance of low weight and good thermal conductivity.
- Structure: Monolithic printing. Features extremely thin walls (down to 0.3mm) and complex internal lattices for fluid mixing.
- Advantage: Eliminates the risk of leakage at joints common in brazed aluminum exchangers and allows for topology optimization to reduce weight.
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Advanced Thermal Management Materials
Pure Copper
Pure Copper printed via Green Laser technology offers exceptional electrical and thermal conductivity. It overcomes the high reflectivity challenges of traditional lasers, delivering high-density parts ideal for heat exchangers, induction coils, and EV components.
CuSn10
CuSn10 is a copper-tin alloy known for its high strength, elasticity, and excellent corrosion resistance. It is widely used in marine applications, artistic jewelry, and functional prototypes requiring durability and moderate conductivity.
CuCrZr
CuCrZr is a heat-treatable copper alloy that retains high strength and conductivity at elevated temperatures. It is the preferred material for rocket engine thrust chambers and high-performance heat sinks requiring thermal stability.
AlSi10Mg
AlSi10Mg is a lightweight aluminum alloy with excellent strength-to-weight ratio and thermal properties. It is widely used for complex geometries in automotive and aerospace structural parts.
6061
Al 6061 offers superior machinability and mechanical properties compared to standard casting alloys. Renowned for its excellent anodizing and coloring capabilities, it is ideal for structural parts requiring precision and premium surface finishes.
Ti6Al4V
Ti6Al4V is the benchmark titanium alloy for additive manufacturing, valued for its exceptional strength-to-weight ratio, biocompatibility, and corrosion resistance. Essential for aerospace components and medical implants.
Printing Advantages in Thermal Management Applications
Unlocking complex flow designs with breakthrough additive technology, defining the next generation of efficient, compact, and leak-proof thermal systems.
Unlimited Design Freedom
Overcoming the limitations of traditional subtractive manufacturing to construct TPMS lattices, conformal cooling channels, and high-aspect-ratio micro-channels. This maximizes surface area and optimizes fluid dynamics for significantly improved heat exchange efficiency.
Integrated & Leak-Proof
Achieving monolithic printing. This completely eliminates weak points caused by traditional brazing, fundamentally removing the risk of coolant leakage and ensuring long-term system reliability.
Material Versatility
Resolving the printing of highly reflective metals like Pure Copper (density ~99.8%), the system also ensures full compatibility with conventional Titanium and Aluminum alloys. This provides a one-stop solution covering diverse performance needs.
Mold-Free Agile Iteration
Direct digital manufacturing eliminates the need for expensive mold development, shortening the R&D verification cycle from months to days. This reduces trial-and-error costs, making it perfectly suited for high-end customization and small-batch pre-research projects.
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