Pure Copper

Pure Copper

Pure Copper

Pure Copper

Overview

Green Laser-printed pure copper has high electrical & thermal conductivity. It overcomes traditional lasers' reflectivity, producing dense parts for heat exchangers, induction coils and EV components.

Material Parameters & Mechanical Properties

Mechanical Properties
PropertyValueUnit
Relative Density~99.8%
Tensile Strength240MPa
Yield Strength165MPa

Application Cases

TPMS Liquid Cold Plates

TPMS Liquid Cold Plates

This is the most critical and frequently mentioned advanced application, utilizing TPMS to optimize fluid dynamics and heat exchange.

Core Advantages

  • Core Structure: Uses Gyroid, or Diamond lattice structures to fill flow channels.
  • Performance Advantage: Provides massive Surface Area compared to traditional channels, ensuring uniform fluid distribution and eliminating Hot Spots.
  • Efficiency Boost: Heat transfer performance improves by approximately 28% under the same pumping power, with significantly reduced flow resistance.
  • Manufacturing: Monolithic printing eliminates brazing and removes leakage risks.
New Generation IGBT Heatsink Base Plate

New Generation IGBT Heatsink Base Plate

Designed for IGBT power modules in EVs or industrial controls, breaking the limits of traditional cold-forged pin fins.

Core Advantages

  • Background: Traditional Pin Fin technology has hit a thermal bottleneck.
  • Micro‑structure Design:
  • Bottom features Irregular concave and convex textures.
  • Surface covered with Conical columns with spiral micro‑structures, impossible with cold forging.
  • Added Horizontal square strips for turbulence induction.
  • Results: Thermal efficiency improved by 30%‑40% within the sameinstallation space.
Data Processor Thermal Module

Data Processor Thermal Module

Addressing poor thermal uniformity in traditional heatsinks for servers or high-performance chips.

Core Advantages

  • Replacement: Replaces copper sheet heatsinks.
  • Design Change: Internally features a fin‑based, needle+rectangular‑based, and a combination of multiple structures.
  • Function: Increases surface area and acts as a fluid Guide, significantly improving thermal uniformity.
Semiconductor Thermal Module

Semiconductor Thermal Module

For semiconductor components with extremely high heat flux density, demanding massive efficiency gains.

Core Advantages

  • Goal: Customer required a 5x efficiency increase over the original copper plate solution.
  • Structure: Combines irregular textures, spiral micro‑structure cones, and horizontal strips into a composite design.
  • Test Results: Final tests showed a 6‑7x increase in thermal efficiency.
  • Process: 3D printed base plate + welded cover (Hybrid manufacturing).
Teardrop-Shaped Liquid Cold Plates

Teardrop-Shaped Liquid Cold Plates

Designed to minimize pressure drop and fluid resistance using hydrodynamic optimization.

Core Advantages

  • Core Design: Features an array of teardrop‑shaped pin fins.
  • Fluid Dynamics: Compared to cylindrical pins, the teardrop shape significantly reduces fluid flow separation and turbulence, leading to a much lower pressure drop.
  • Efficiency: Maintains high heat transfer efficiency while allowing for lower pumping power or higher flow rates.
Conformal Channel Liquid Cold Plate

Conformal Channel Liquid Cold Plate

Utilizing 3D printing freedom to create non-linear, conformal cooling channels.

Core Advantages

  • Conformal Cooling: Channels are designed to follow the 3D contour of the heat source, rather than a simple 2D plane.
  • Internal Features: Internally features a fin‑based, needle+rectangular‑based, and a combination of multiple structures to maximize turbulence and surface area in critical zones.
  • Benefits: Solves the issue of uneven heating in complex‑shaped components where traditional machining cannot reach.

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